Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424453 | Low temperature direct copper-copper bonding | Stephen J. Banik, II, Justin Oberst, Kari Thorkelsson, Thomas A. Ponnuswamy | 2025-09-23 |
| 12331421 | Edge removal for through-resist plating in an electro-plating cup assembly | Stephen J. Banik, II | 2025-06-17 |
| 12293943 | Gold through silicon mask plating | Lee Peng Chua, Defu Liang, Jacob Kurtis Blickensderfer, Thomas A. Ponnuswamy, Steven T. Mayer | 2025-05-06 |
| 12247310 | Lipseal edge exclusion engineering to maintain material integrity at wafer edge | Justin Oberst, Kari Thorkelsson | 2025-03-11 |