Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424453 | Low temperature direct copper-copper bonding | Justin Oberst, Kari Thorkelsson, Bryan L. Buckalew, Thomas A. Ponnuswamy | 2025-09-23 |
| 12331421 | Edge removal for through-resist plating in an electro-plating cup assembly | Bryan L. Buckalew | 2025-06-17 |