Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424453 | Low temperature direct copper-copper bonding | Stephen J. Banik, II, Justin Oberst, Bryan L. Buckalew, Thomas A. Ponnuswamy | 2025-09-23 |
| 12247310 | Lipseal edge exclusion engineering to maintain material integrity at wafer edge | Justin Oberst, Bryan L. Buckalew | 2025-03-11 |