Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424527 | Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages | Paul R. Hoffman, Clifford Sandstrom | 2025-09-23 |
| 12424450 | Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same | Craig Bishop, Andrew Hoetker, Ryan Sanden, Paul R. Hoffman | 2025-09-23 |
| 12381154 | Fully molded bridge interposer and method of making the same | Craig Bishop, Clifford Sandstrom | 2025-08-05 |
| 12362322 | Method of making a fan-out semiconductor assembly with an intermediate carrier | Paul R. Hoffman | 2025-07-15 |
| 12334396 | Unit specific variable or adaptive metal fill and system and method for the same | David Ryan Bartling, Craig Bishop | 2025-06-17 |
| 12300561 | Fully molded structure with multi-height components comprising backside conductive material and method for making the same | Clifford Sandstrom, Paul R. Hoffman, Robin Davis | 2025-05-13 |
| 12261140 | Stackable fully molded semiconductor structure with vertical interconnects | Edward Hudson, Craig Bishop | 2025-03-25 |
| 12205881 | Semiconductor assembly comprising a 3D block and method of making the same | Craig Bishop, Robin Davis, Paul R. Hoffman | 2025-01-21 |