Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424450 | Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same | Andrew Hoetker, Ryan Sanden, Paul R. Hoffman, Timothy L. Olson | 2025-09-23 |
| 12381154 | Fully molded bridge interposer and method of making the same | Timothy L. Olson, Clifford Sandstrom | 2025-08-05 |
| 12334396 | Unit specific variable or adaptive metal fill and system and method for the same | David Ryan Bartling, Timothy L. Olson | 2025-06-17 |
| 12261140 | Stackable fully molded semiconductor structure with vertical interconnects | Timothy L. Olson, Edward Hudson | 2025-03-25 |
| 12205881 | Semiconductor assembly comprising a 3D block and method of making the same | Timothy L. Olson, Robin Davis, Paul R. Hoffman | 2025-01-21 |