Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424527 | Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages | Timothy L. Olson, Paul R. Hoffman | 2025-09-23 |
| 12381154 | Fully molded bridge interposer and method of making the same | Timothy L. Olson, Craig Bishop | 2025-08-05 |
| 12300561 | Fully molded structure with multi-height components comprising backside conductive material and method for making the same | Paul R. Hoffman, Robin Davis, Timothy L. Olson | 2025-05-13 |