Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300561 | Fully molded structure with multi-height components comprising backside conductive material and method for making the same | Clifford Sandstrom, Paul R. Hoffman, Timothy L. Olson | 2025-05-13 |
| 12205881 | Semiconductor assembly comprising a 3D block and method of making the same | Timothy L. Olson, Craig Bishop, Paul R. Hoffman | 2025-01-21 |