Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424450 | Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same | Craig Bishop, Andrew Hoetker, Ryan Sanden, Timothy L. Olson | 2025-09-23 |
| 12424527 | Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages | Timothy L. Olson, Clifford Sandstrom | 2025-09-23 |
| 12362322 | Method of making a fan-out semiconductor assembly with an intermediate carrier | Timothy L. Olson | 2025-07-15 |
| 12300561 | Fully molded structure with multi-height components comprising backside conductive material and method for making the same | Clifford Sandstrom, Robin Davis, Timothy L. Olson | 2025-05-13 |
| 12259427 | Thermal head comprising a plurality of adapters for independent thermal control of zones | Thomas P. Jones, Samer Kabbani, Chan See Jean | 2025-03-25 |
| 12205881 | Semiconductor assembly comprising a 3D block and method of making the same | Timothy L. Olson, Craig Bishop, Robin Davis | 2025-01-21 |