Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272545 | Embedded metal contamination removal from BEOL wafers | Devika Sil, Ashim Dutta, Yann Mignot, John C. Arnold, Daniel C. Edelstein +1 more | 2025-04-08 |
| 12266607 | Bottom barrier free interconnects without voids | Kenneth Chun Kuen Cheng, Koichi Motoyama, Kisik Choi, Hosadurga Shobha, Joe Lee | 2025-04-01 |