Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148676 | Embedded chip package and manufacturing method thereof | Xianming Chen, Jindong FENG, Lei Feng, Wenshi Wang | 2024-11-19 |
| 12074115 | Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate | Xianming Chen, Bingsen Xie, Lei Feng | 2024-08-27 |
| 12040272 | Connector for implementing multi-faceted interconnection | Xianming Chen, Lei Feng, Yejie HONG | 2024-07-16 |
| 12040526 | Method for manufacturing embedded package structure having air resonant cavity | Xianming Chen, Lei Feng, Jindong FENG, Yejie HONG | 2024-07-16 |
| 12002734 | Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Jindong FENG, Minxiong Li, Shigui Xin +1 more | 2024-06-04 |
| 11984414 | Packaging structure with antenna and manufacturing method thereof | Xianming Chen, Lei Feng, Wenshi Wang | 2024-05-14 |
| 11961743 | Substrate manufacturing method for realizing three-dimensional packaging | Xianming Chen, Yejie HONG, Lei Feng | 2024-04-16 |
| 11942465 | Embedded structure, manufacturing method thereof and substrate | Xianming Chen, Bingsen Xie, Lei Feng, Wenshi Wang | 2024-03-26 |
| 11903133 | Structure for embedding and packaging multiple devices by layer and method for manufacturing same | Xianming Chen, Lei Feng, Gao HUANG, Yejie HONG | 2024-02-13 |