Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148676 | Embedded chip package and manufacturing method thereof | Xianming Chen, Benxia HUANG, Lei Feng, Wenshi Wang | 2024-11-19 |
| 12040526 | Method for manufacturing embedded package structure having air resonant cavity | Xianming Chen, Lei Feng, Benxia HUANG, Yejie HONG | 2024-07-16 |
| 12002734 | Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Minxiong Li, Shigui Xin +1 more | 2024-06-04 |