Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040272 | Connector for implementing multi-faceted interconnection | Xianming Chen, Lei Feng, Benxia HUANG | 2024-07-16 |
| 12040526 | Method for manufacturing embedded package structure having air resonant cavity | Xianming Chen, Lei Feng, Benxia HUANG, Jindong FENG | 2024-07-16 |
| 11961743 | Substrate manufacturing method for realizing three-dimensional packaging | Xianming Chen, Benxia HUANG, Lei Feng | 2024-04-16 |
| 11903133 | Structure for embedding and packaging multiple devices by layer and method for manufacturing same | Xianming Chen, Lei Feng, Gao HUANG, Benxia HUANG | 2024-02-13 |