Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148676 | Embedded chip package and manufacturing method thereof | Xianming Chen, Jindong FENG, Benxia HUANG, Lei Feng | 2024-11-19 |
| 12002734 | Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Jindong FENG, Minxiong Li +1 more | 2024-06-04 |
| 11984414 | Packaging structure with antenna and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG | 2024-05-14 |
| 11942465 | Embedded structure, manufacturing method thereof and substrate | Xianming Chen, Bingsen Xie, Benxia HUANG, Lei Feng | 2024-03-26 |