Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074115 | Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate | Xianming Chen, Benxia HUANG, Lei Feng | 2024-08-27 |
| 11942465 | Embedded structure, manufacturing method thereof and substrate | Xianming Chen, Benxia HUANG, Lei Feng, Wenshi Wang | 2024-03-26 |