JC

Jie Chen

TSMC: 22 patents #97 of 4,162Top 3%
IC Innogrit Technologies Co.: 11 patents #1 of 22Top 5%
Huawei: 3 patents #573 of 4,704Top 15%
BT Beijing Institute Of Technology: 2 patents #4 of 99Top 5%
Samsung: 2 patents #4,211 of 17,120Top 25%
SU Shanghai Jiao Tong University: 1 patents #43 of 257Top 20%
SP State Grid Shanghai Municipal Electric Power: 1 patents #1 of 11Top 10%
TU Tongji University: 1 patents #28 of 154Top 20%
Wells Fargo Bank, N.A.: 1 patents #307 of 964Top 35%
WU Wuhan University: 1 patents #20 of 75Top 30%
ZU Zhejiang University: 1 patents #175 of 773Top 25%
IN Intel: 1 patents #1,727 of 4,430Top 40%
AM Amazon: 1 patents #1,148 of 4,653Top 25%
TI Texas Instruments: 1 patents #500 of 1,319Top 40%
CT Changzhou Institute Of Technology: 1 patents #2 of 10Top 20%
HT Hefei University Of Technology: 1 patents #35 of 159Top 25%
HL Hkc Corporation Limited: 1 patents #62 of 156Top 40%
PS Polymer Technology Systems: 1 patents #1 of 7Top 15%
📍 Shanghai, CA: #2 of 488 inventorsTop 1%
Overall (2024): #358 of 561,600Top 1%
54
Patents 2024

Issued Patents 2024

Showing 26–50 of 54 patents

Patent #TitleCo-InventorsDate
12068285 Stacked die structure and method of fabricating the same Hsien-Wei Chen, Ming-Fa Chen 2024-08-20
12062608 Semiconductor packages Hsien-Wei Chen, Ming-Fa Chen 2024-08-13
12038852 Partial logical-to-physical (L2P) address translation table for multiple namespaces Bo Fu, Lin Chen, Cheng-Yun Hsu 2024-07-16
12032441 Systems and methods for an ECC architecture with memory mapping Xiaoming Zhu, Bo Fu, Zining Wu 2024-07-09
12009841 Error recovery using adaptive LLR lookup table Han Zhang, Chenrong Xiong 2024-06-11
12009386 Structure and method for forming integrated high density MIM capacitor Hsien-Wei Chen, Ying-Ju Chen, Ming-Fa Chen 2024-06-11
12009316 Semiconductor structure and method of manufacturing a semiconductor structure Hsien-Wen Liu, Hsien-Wei Chen 2024-06-11
12002778 Semiconductor packages and methods of forming the same Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh 2024-06-04
11996401 Packaged die and RDL with bonding structures therebetween Hsien-Wei Chen 2024-05-28
11994986 Valid data retrieval for garbage collection Bo Fu 2024-05-28
11973170 Semiconductor package and manufacturing method of semiconductor package Ming-Fa Chen, Hsien-Wei Chen 2024-04-30
11973516 Soft decoding correctable page assisted LLR estimation Chenrong Xiong 2024-04-30
11967971 Concatenated error correcting codes Chenrong Xiong 2024-04-23
11961439 Display panel, driving method and display device Jianlei Li, Haijiang Yuan 2024-04-16
11960127 Semiconductor package and manufacturing method thereof Hsien-Wei Chen, Ming-Fa Chen 2024-04-16
11939503 Method for preparing manganese-doped red phosphor, product, device, and backlight module Lei Chen, Peng Cheng, Yunfei Tian, Jialong Wang, Liangrui He +2 more 2024-03-26
11942791 Self-powered wireless keyboard Fang Deng, Yanxin Ji, Xinyu Fan, Yeyun Cai, Chengwei Mi +2 more 2024-03-26
11942454 Package and manufacturing method thereof Hsien-Wei Chen, Ming-Fa Chen 2024-03-26
11940887 Cache program with backup blocks Gang Zhao, Lin Chen, Qun Zhao 2024-03-26
11936403 Systems and methods for decoding codewords in a same page with historical decoding information Bo Fu, Han Zhang, Zining Wu 2024-03-19
11924462 Encoding and decoding method and device for determining a decoding order between a left and a right lower blocks Yin-ji Piao, Elena Alshina 2024-03-05
11923028 Reference voltage adjustment based on post-decoding and pre-decoding state information Chenrong Xiong 2024-03-05
11908692 Method for fabricating a chip package Hsien-Wei Chen, Tzuan-Horng Liu, Ying-Ju Chen 2024-02-20
11909551 Broadband remote access server (BRAS) system-based packet encapsulation Zhouyi Yu, Hongtao Guo, Qian Cao 2024-02-20
11907882 Model validation of credit risk Vijayan Nair, Agus Sudjianto, Weicheng Liu, Kevin D. Oden 2024-02-20