Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074116 | Integrated package structure | Yaojian Lin, Haitao Shi, Xueqing Chen, SHASHA ZHOU, Shuo Liu | 2024-08-27 |
| 11942563 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Tsang-Yu Liu, Kuei-Wei Chen | 2024-03-26 |