Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942563 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Kuei-Wei Chen | 2024-03-26 |
| 11873212 | Chip package and manufacturing method thereof | Wei-Luen SUEN, Jiun-Yen LAI, Hsing-Lung SHEN | 2024-01-16 |