Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942563 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Jian-Hong Chen, Tsang-Yu Liu, Kuei-Wei Chen | 2024-03-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942563 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Jian-Hong Chen, Tsang-Yu Liu, Kuei-Wei Chen | 2024-03-26 |