Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935859 | Chip structure and manufacturing method thereof | Chia-Hsiang Chen | 2024-03-19 |
| 11873212 | Chip package and manufacturing method thereof | Wei-Luen SUEN, Hsing-Lung SHEN, Tsang-Yu Liu | 2024-01-16 |