Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148681 | Fan-out package structure and method for manufacturing the same | Jian Zuo, Danfeng Yang, Yinghua Gao, Shuo Liu | 2024-11-19 |
| 12107058 | Split RDL connection between die and UBM | Jian Zuo | 2024-10-01 |
| 12094729 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu | 2024-09-17 |
| 12094843 | Antenna in embedded wafer-level ball-grid array package | Pandi C. Marimuthu, Andy Chang Bum Yong, Aung Kyaw Oo | 2024-09-17 |
| 12080600 | Semiconductor device and method to minimize stress on stack via | Seng Guan Chow | 2024-09-03 |
| 12074116 | Integrated package structure | Haitao Shi, Xueqing Chen, Jian-Hong Chen, SHASHA ZHOU, Shuo Liu | 2024-08-27 |
| 11978694 | Dual-substrate antenna package structure and method for manufacturing the same | Shuo Liu, Chen Xu, Haitao Shi | 2024-05-07 |
| 11961764 | Semiconductor device and method of making a wafer-level chip-scale package | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2024-04-16 |