Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094729 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Seung Wook Yoon, Pandi C. Marimuthu | 2024-09-17 |
| 11961764 | Semiconductor device and method of making a wafer-level chip-scale package | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Seung Wook Yoon +1 more | 2024-04-16 |