Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094729 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon | 2024-09-17 |
| 12094843 | Antenna in embedded wafer-level ball-grid array package | Andy Chang Bum Yong, Aung Kyaw Oo, Yaojian Lin | 2024-09-17 |
| 11961764 | Semiconductor device and method of making a wafer-level chip-scale package | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2024-04-16 |