Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148681 | Fan-out package structure and method for manufacturing the same | Yaojian Lin, Jian Zuo, Danfeng Yang, Yinghua Gao | 2024-11-19 |
| 12074116 | Integrated package structure | Yaojian Lin, Haitao Shi, Xueqing Chen, Jian-Hong Chen, SHASHA ZHOU | 2024-08-27 |
| 11978694 | Dual-substrate antenna package structure and method for manufacturing the same | Chen Xu, Yaojian Lin, Haitao Shi | 2024-05-07 |