Issued Patents 2024
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183695 | Method of manufacturing package structure | Chia-Ping Lai | 2024-12-31 |
| 12154869 | Semiconductor package with high density of through-silicon vias (TSV) | — | 2024-11-26 |
| 12154808 | System and method for wafer manufacturing process management | Mei-Hsuan Lin, Rong Fan | 2024-11-26 |
| 12125761 | Semiconductor package including package seal ring and methods for forming the same | — | 2024-10-22 |
| 12107078 | Semiconductor die including fuse structure and methods for forming the same | Chia-Ping Lai | 2024-10-01 |
| 12094868 | Shielded deep trench capacitor structure and methods of forming the same | Chia-Ping Lai, Chien-Chang Lee | 2024-09-17 |
| 12096588 | Server chassis | Han-Sheng Chen, Po-Hsiu Chen, Hsieh-Liang Tsai | 2024-09-17 |
| 12094925 | Three-dimensional device structure including embedded integrated passive device and methods of making the same | Chien-Chang Lee, Chia-Ping Lai, Tzu-Chung Tsai | 2024-09-17 |
| 12094844 | Semiconductor package including test pad and bonding pad structure for die connection and methods for forming the same | — | 2024-09-17 |
| 12087729 | Multi-chip package having stress relief structure | — | 2024-09-10 |
| 12087709 | Guard ring and manufacturing method thereof | — | 2024-09-10 |
| 12080656 | Electromagnetic shielding structure for a semiconductor device and a method for manufacturing the same | — | 2024-09-03 |
| 12068262 | Semiconductor package including neighboring die contact and seal ring structures, and methods for forming the same | Chia-Ping Lai | 2024-08-20 |
| 12039244 | Hybrid node chiplet stacking design | Jheng-Hong Jiang, Chin-Chou Liu, Long Song Lin | 2024-07-16 |
| 12040242 | Three-dimensional device structure including seal ring connection circuit | Chien-Chang Lee, Chia-Ping Lai | 2024-07-16 |
| 12033959 | Dummy pattern structure for reducing dishing | — | 2024-07-09 |
| 12030102 | Hemming system and method that incorporates expected springback to form a continuous path | Yi-Ping Huang, Ya-Hui Tsai, Wei Li, Bor-Tung Jiang, Chia-Hung Wu | 2024-07-09 |
| 12027475 | Semiconductor die including guard ring structure and three-dimensional device structure including the same | Chien-Chang Lee, Chia-Ping Lai | 2024-07-02 |
| 12027403 | Pick-and-place system with a stabilizer | — | 2024-07-02 |
| 12021069 | Semiconductor die and photoelectric device integrated in same package | Chia-Ping Lai | 2024-06-25 |
| 12015010 | Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods of forming the same | Chia-Ping Lai | 2024-06-18 |
| 12009405 | Deep trench capacitor including a compact contact region and methods of forming the same | Chia-Ping Lai, Chien-Chang Lee | 2024-06-11 |
| 12009349 | Vertical semiconductor package including horizontally stacked dies and methods of forming the same | Chia-Ping Lai | 2024-06-11 |
| 12001308 | Creating method of classification model about hard disk efficiency problem, analysis method of hard disk efficiency problem and classification model creating system about hard disk efficiency problem | Yi-Ju Liao, Po-Hsiu Chen, Hsieh-Liang Tsai | 2024-06-04 |
| 11984376 | Stacked semiconductor device including a cooling structure | — | 2024-05-14 |