Issued Patents 2024
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11940662 | Semiconductor structure and method for forming the same | Chia-Ping Lai | 2024-03-26 |
| 11935798 | Stacked semiconductor device test circuits and methods of use | — | 2024-03-19 |
| 11929348 | Vertically mounted die groups | — | 2024-03-12 |
| 11923263 | Semiconductor device and method of forming | — | 2024-03-05 |
| 11923355 | Deep trench capacitor fuse structure for high voltage breakdown defense and methods for forming the same | — | 2024-03-05 |
| 11916037 | Method for bonding semiconductor devices, method for forming semiconductor structure and system for performing the method | — | 2024-02-27 |
| 11908838 | Three-dimensional device structure including embedded integrated passive device and methods of making the same | Chien-Chang Lee, Chia-Ping Lai, Tzu-Chung Tsai | 2024-02-20 |
| 11869859 | Die stack and integrated device structure including improved bonding structure and methods of forming the same | — | 2024-01-09 |
| 11862610 | Fan-out packages providing enhanced mechanical strength and methods for forming the same | Chia-Ping Lai | 2024-01-02 |
| 11862609 | Semiconductor die including fuse structure and methods for forming the same | Chia-Ping Lai | 2024-01-02 |