Issued Patents 2024
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183695 | Method of manufacturing package structure | Jen-Yuan Chang | 2024-12-31 |
| 12169308 | Method of using fiber to chip coupler and method of making | Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu, Chen-Hao Huang, Chien-Chang Lee | 2024-12-17 |
| 12153255 | Method of making photonic device | Chien-Ying Wu, Yuehying Lee, Sui-Ying Hsu, Chen-Hao Huang, Chien-Chang Lee | 2024-11-26 |
| 12125868 | Image sensors with dummy pixel structures | Yu-Wei Chen, Chung-Chuan Tseng, Chiao-Chi Wang | 2024-10-22 |
| 12107078 | Semiconductor die including fuse structure and methods for forming the same | Jen-Yuan Chang | 2024-10-01 |
| 12094868 | Shielded deep trench capacitor structure and methods of forming the same | Jen-Yuan Chang, Chien-Chang Lee | 2024-09-17 |
| 12094925 | Three-dimensional device structure including embedded integrated passive device and methods of making the same | Jen-Yuan Chang, Chien-Chang Lee, Tzu-Chung Tsai | 2024-09-17 |
| 12072534 | Fiber to chip coupler and method of using | Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu, Chen-Hao Huang, Chien-Chang Lee | 2024-08-27 |
| 12068262 | Semiconductor package including neighboring die contact and seal ring structures, and methods for forming the same | Jen-Yuan Chang | 2024-08-20 |
| 12057467 | Image sensor device and methods of forming the same | Yeh-Hsun Fang, Chiao-Chi Wang, Chung-Chuan Tseng | 2024-08-06 |
| 12050348 | Fiber to chip coupler and method of making the same | Chen-Hao Huang, Hau-Yan Lu, Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu +1 more | 2024-07-30 |
| 12040242 | Three-dimensional device structure including seal ring connection circuit | Jen-Yuan Chang, Chien-Chang Lee | 2024-07-16 |
| 12027475 | Semiconductor die including guard ring structure and three-dimensional device structure including the same | Jen-Yuan Chang, Chien-Chang Lee | 2024-07-02 |
| 12021069 | Semiconductor die and photoelectric device integrated in same package | Jen-Yuan Chang | 2024-06-25 |
| 12015010 | Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods of forming the same | Jen-Yuan Chang | 2024-06-18 |
| 12009405 | Deep trench capacitor including a compact contact region and methods of forming the same | Jen-Yuan Chang, Chien-Chang Lee | 2024-06-11 |
| 12009349 | Vertical semiconductor package including horizontally stacked dies and methods of forming the same | Jen-Yuan Chang | 2024-06-11 |
| 11996439 | Integrated circuit including trench capacitor | Wen-Feng Kuo, Chung-Chuan Tseng | 2024-05-28 |
| 11973040 | Interposer with warpage-relief trenches | Tsung-Yang Hsieh, Chien-Chang Lee, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo +1 more | 2024-04-30 |
| 11961866 | Method of making an image sensor with sidewall protection | Chiao-Chi Wang, Chung-Chuan Tseng | 2024-04-16 |
| 11940659 | Optical integrated circuit structure including edge coupling protective features and methods of forming same | Chen-Hao Huang, Hau-Yan Lu, Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu | 2024-03-26 |
| 11940662 | Semiconductor structure and method for forming the same | Jen-Yuan Chang | 2024-03-26 |
| 11908838 | Three-dimensional device structure including embedded integrated passive device and methods of making the same | Jen-Yuan Chang, Chien-Chang Lee, Tzu-Chung Tsai | 2024-02-20 |
| 11892681 | Fiber to chip coupler and method of making the same | Chen-Hao Huang, Hau-Yan Lu, Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu +1 more | 2024-02-06 |
| 11894411 | Image sensor device and methods of forming the same | Yeh-Hsun Fang, Chiao-Chi Wang, Chung-Chuan Tseng | 2024-02-06 |