Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12030102 | Hemming system and method that incorporates expected springback to form a continuous path | Yi-Ping Huang, Ya-Hui Tsai, Bor-Tung Jiang, Chia-Hung Wu, Jen-Yuan Chang | 2024-07-09 |
| 11996292 | Methods for filling a gap feature on a substrate surface and related semiconductor structures | Kunal Bhatnagar, Ashwin Agathya Boochakravathy | 2024-05-28 |