Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176327 | Method for fabricating electronic package | Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chi-Hsin Chiu | 2024-12-24 |
| 12100642 | Electronic package and fabrication method thereof | Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu | 2024-09-24 |
| 12080618 | Electronic package, heat dissipation structure and manufacturing method thereof | Yu-Lung Huang, Kuo-Hua Yu | 2024-09-03 |
| 12027484 | Electronic package and carrier thereof and method for manufacturing the same | Chi-Ren Chen, Po-Yung Chang, Pei-Geng Weng, Yuan-Hung Hsu, Don-Son Jiang | 2024-07-02 |
| 11984379 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu | 2024-05-14 |
| 11973014 | Method of manufacturing substrate structure with filling material formed in concave portion | Chin-Tsai Yao, Chun-Tang Lin, Fu-Tang Huang | 2024-04-30 |