Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176327 | Method for fabricating electronic package | Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu | 2024-12-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176327 | Method for fabricating electronic package | Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu | 2024-12-24 |