Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176327 | Method for fabricating electronic package | Kong-Toon Ng, Hung-Ho Lee, Chang-Fu Lin, Chi-Hsin Chiu | 2024-12-24 |
| 12100642 | Electronic package and fabrication method thereof | Yu-Lung Huang, Chang-Fu Lin, Yuan-Hung Hsu | 2024-09-24 |
| 11881459 | Electronic package and fabrication method thereof | Yu-Lung Huang, Yuan-Hung Hsu, Chi-Jen Chen | 2024-01-23 |