Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100642 | Electronic package and fabrication method thereof | Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu | 2024-09-24 |
| 12080618 | Electronic package, heat dissipation structure and manufacturing method thereof | Kuo-Hua Yu, Chang-Fu Lin | 2024-09-03 |
| 11984379 | Electronic package and manufacturing method thereof | Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin | 2024-05-14 |
| 11881459 | Electronic package and fabrication method thereof | Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen | 2024-01-23 |