Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132003 | Electronic package and manufacturing method thereof | You-Chen Lin, Yu-Min Lo, Jun FENG | 2024-10-29 |
| 12080618 | Electronic package, heat dissipation structure and manufacturing method thereof | Yu-Lung Huang, Chang-Fu Lin | 2024-09-03 |
| 11984379 | Electronic package and manufacturing method thereof | Yu-Lung Huang, Chih-Ming Huang, Chang-Fu Lin | 2024-05-14 |