Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080671 | Layered bonding material, semiconductor package, and power module | Naoto Kameda, Masato Tsuchiya | 2024-09-03 |
| 12053843 | Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device | Shunsaku Yoshikawa, Takashi Saito, Yuuki Iijima, Takahiro Matsufuji | 2024-08-06 |