Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119571 | Antenna device | — | 2024-10-15 |
| 12080671 | Layered bonding material, semiconductor package, and power module | Naoto Kameda, Kanta Dei | 2024-09-03 |
| 12027784 | Antenna device | Shun HIRANO, Shinya Yamamoto, Raita Nakanishi, Tomoyuki Kuge | 2024-07-02 |
| 11872656 | Core material, electronic component and method for forming bump electrode | Shigeki Kondoh, Hiroki Sudo, Hiroshi Okada, Daisuke Souma | 2024-01-16 |