Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11872656 | Core material, electronic component and method for forming bump electrode | Masato Tsuchiya, Hiroki Sudo, Hiroshi Okada, Daisuke Souma | 2024-01-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11872656 | Core material, electronic component and method for forming bump electrode | Masato Tsuchiya, Hiroki Sudo, Hiroshi Okada, Daisuke Souma | 2024-01-16 |