Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12109653 | Solder alloy, solder ball, solder paste, and solder joint | Takahiro Matsufuji, Shunsaku Yoshikawa | 2024-10-08 |
| 12095906 | Secret survival data processing system, secret survival data processing apparatus, secret survival data processing method, and program | Atsunori ICHIKAWA, Dai Ikarashi, Koki Hamada, Ryo Kikuchi, Ibuki MISHINA | 2024-09-17 |
| 11872656 | Core material, electronic component and method for forming bump electrode | Shigeki Kondoh, Masato Tsuchiya, Hiroshi Okada, Daisuke Souma | 2024-01-16 |