Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12179291 | Method for step-soldering | Takashi Saito, Naoko IZUMITA | 2024-12-31 |
| 12109653 | Solder alloy, solder ball, solder paste, and solder joint | Takahiro Matsufuji, Hiroki Sudo | 2024-10-08 |
| 12053843 | Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device | Takashi Saito, Yuuki Iijima, Kanta Dei, Takahiro Matsufuji | 2024-08-06 |
| 11992902 | Solder alloy and solder joint | Takahiro Yokoyama | 2024-05-28 |