Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12109653 | Solder alloy, solder ball, solder paste, and solder joint | Shunsaku Yoshikawa, Hiroki Sudo | 2024-10-08 |
| 12053843 | Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device | Shunsaku Yoshikawa, Takashi Saito, Yuuki Iijima, Kanta Dei | 2024-08-06 |