Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080671 | Layered bonding material, semiconductor package, and power module | Kanta Dei, Masato Tsuchiya | 2024-09-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080671 | Layered bonding material, semiconductor package, and power module | Kanta Dei, Masato Tsuchiya | 2024-09-03 |