Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148729 | Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same | Choongbin Yim, Jihwang Kim | 2024-11-19 |
| 12062605 | Semiconductor package including an interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Eunhee Jung, Kyoungsei Choi | 2024-08-13 |
| 12033924 | Semiconductor package | Jeonghyun Lee, Hwanpil Park | 2024-07-09 |
| 12021036 | Semiconductor package including interposer and method of manufacturing the semiconductor package | Jihwang Kim, Choongbin Yim | 2024-06-25 |
| 11948873 | Semiconductor package including a support solder ball | Jeonghyun Lee, Dongwook Kim, Hwan Pil Park | 2024-04-02 |
| 11876083 | Semiconductor package | Dongho Kim, Ji Hwang Kim, Hwan Pil Park | 2024-01-16 |