Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062605 | Semiconductor package including an interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Jongbo Shim, Kyoungsei Choi | 2024-08-13 |
EJ
Eunhee Jung
Overall (2024): #471,924 of 561,600Top 85%
1
Patents 2024