Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948873 | Semiconductor package including a support solder ball | Jeonghyun Lee, Dongwook Kim, Jongbo Shim | 2024-04-02 |
| 11908806 | Semiconductor package and method of fabricating the same | Dong Ho Kim, Ji Hwang Kim, Jong Bo Shim | 2024-02-20 |
| 11876083 | Semiconductor package | Dongho Kim, Ji Hwang Kim, Jongbo Shim | 2024-01-16 |