Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113087 | Image sensor package | Ji Hwang Kim, Sang-Uk Han, Cha-Jea Jo, Won-Il Lee | 2024-10-08 |
| 12057366 | Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package | Ji Hwang Kim, Jang-woo Lee, Yung-Cheol Kong, Young Hoon Hyun | 2024-08-06 |
| 11908806 | Semiconductor package and method of fabricating the same | Dong Ho Kim, Ji Hwang Kim, Hwan Pil Park | 2024-02-20 |