Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148729 | Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same | Jihwang Kim, Jongbo Shim | 2024-11-19 |
| 12021036 | Semiconductor package including interposer and method of manufacturing the semiconductor package | Jongbo Shim, Jihwang Kim | 2024-06-25 |