Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136581 | Semiconductor package structure and fabrication method thereof | Youngho Kim | 2024-11-05 |
| 12033924 | Semiconductor package | Jeonghyun Lee, Jongbo Shim | 2024-07-09 |
HP
Hwanpil Park
Overall (2024): #159,815 of 561,600Top 30%
2
Patents 2024