Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046545 | Hybrid reconstituted substrate for electronic packaging | Jonghae Kim, Milind Shah | 2024-07-23 |
| 11973019 | Deep trench capacitors in an inter-layer medium on an interconnect layer of an integrated circuit die and related methods | Jihong Choi, Stanley Seungchul Song, Giridhar Nallapati | 2024-04-30 |
| 11894366 | Trench capacitor assembly for high capacitance density | Jonghae Kim, Milind Shah | 2024-02-06 |