Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973019 | Deep trench capacitors in an inter-layer medium on an interconnect layer of an integrated circuit die and related methods | Stanley Seungchul Song, Giridhar Nallapati, Periannan Chidambaram | 2024-04-30 |