Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973019 | Deep trench capacitors in an inter-layer medium on an interconnect layer of an integrated circuit die and related methods | Jihong Choi, Stanley Seungchul Song, Periannan Chidambaram | 2024-04-30 |
| 11973020 | Metal-insulator-metal capacitor with top contact | John Jianhong Zhu, Lixin Ge | 2024-04-30 |
| 11942414 | Integrated circuits (ICs) employing directly coupled metal lines between vertically-adjacent interconnect layers for reduced coupling resistance, and related methods | John Jianhong Zhu, Junjing Bao | 2024-03-26 |