Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046545 | Hybrid reconstituted substrate for electronic packaging | Jonghae Kim, Periannan Chidambaram | 2024-07-23 |
| 11894366 | Trench capacitor assembly for high capacitance density | Jonghae Kim, Periannan Chidambaram | 2024-02-06 |