| 12155373 |
Backend and acoustic process integration for high-Q filter |
Kai Liu, Je-Hsiung Lan |
2024-11-26 |
| 12153466 |
Support member supporting slidable display and electronic device including the same |
— |
2024-11-26 |
| 12142561 |
Integrated device and integrated passive device comprising magnetic material |
Kai Liu, Je-Hsiung Lan |
2024-11-12 |
| 12046530 |
Thermal bridge interposer structure |
Je-Hsiung Lan, Ranadeep Dutta |
2024-07-23 |
| 12046545 |
Hybrid reconstituted substrate for electronic packaging |
Milind Shah, Periannan Chidambaram |
2024-07-23 |
| 12040268 |
Thin film resistor (TFR) device structure for high performance radio frequency (RF) filter design |
Je-Hsiung Lan, Kai Liu, Nosun PARK |
2024-07-16 |
| 12007808 |
Foldable electronic device |
Myeongsil PARK, Joohoon Lee, Seonghoon KIM |
2024-06-11 |
| 11984874 |
Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods |
Ranadeep Dutta, Je-Hsiung Lan |
2024-05-14 |
| 11960321 |
Foldable electronic device comprising integrated-adhesive layer and adhesion prevention part |
Seonghoon KIM, Sungho AHN, Kwangtai KIM, Donghyun YEOM |
2024-04-16 |
| 11894366 |
Trench capacitor assembly for high capacitance density |
Milind Shah, Periannan Chidambaram |
2024-02-06 |
| 11876085 |
Package with a substrate comprising an embedded capacitor with side wall coupling |
Abinash ROY, Lohith Kumar Vemula, Bharani Chava |
2024-01-16 |
| 11862367 |
ESL-less AC resistor for high frequency applications |
Sang-June Park, Je-Hsiung Lan, Ranadeep Dutta |
2024-01-02 |
